Siemens Simcenter FloTHERM XT 2304.0

Download Siemens Simcenter FloTHERM XT 2304.0

Siemens Simcenter FloTHERM XT

Simcenter Flotherm XT, CAD centric electronics cooling simulation software, connects MCAD and ECAD workflows to significantly shorten the thermal design process.

Built on DNA of Simcenter Flotherm, mechanical engineers and thermal specialists can easily handle and modify native CAD geometry for accurate CFD studies in an intuitive interface designed for electronics thermal analysis. A robust EDA data import process is coupled with modeling fidelity options for PCB thermal modeling including copper trace joule heating. Engineers designing electronics thermal management solutions featuring heatsinks, fans, TECs, or liquid cooling can eliminate typical overheads in model creation and utilize parametric studies to optimize designs faster.

Siemens Simcenter FloTHERM what is new in Simcenter FloTHERM XT

The latest release of Simcenter Flotherm XT 2020.1 – CAD Centric electronics cooling software and sister product to Simcenter Flotherm, has just been announced. Let’s take a look at new functionalities that continue to support the creation of a thermal digital twin of an electronics product during development and also enhance productivity and workflow.

Accelerating package thermal modeling – chip array added to Simcenter Flotherm Package Creator

The prior release, Simcenter Flotherm XT 2019.3, featured the launch of Simcenter Flotherm Package Creator to accelerate thermal modeling through fast and guided generation of clean CAD geometry based, detailed chip package models. Newly added to Simcenter Flotherm Package Creator is the Chip Array style (CABGA) package type under Ball Grid Array Package families. This enables engineers to quickly create Chip Array type detailed package models to integrate into 3D electronics cooling models.

Multiple heat sources on a die – Excel import ease of use

In response to user feedback, a faster way to build and specify power to multiple heat sources on a single die in an electronics package model has been created in Simcenter Flotherm Package Creator.  Users can now directly import from Microsoft Excel, the data to specify position, size and power applied when creating a package.

Transient electronics cooling simulation – Simplified thermostatic control

From modern electronics, e.g smartphones and tablets, to power electronics in electric vehicles – transient thermal modeling has increasingly been adopted to better model in-use scenarios and evaluate power control strategies to go beyond the prediction of critical component temperatures for reliability purposes.

Performing full 3D transient thermal CFD analysis is computationally intensive and simulation time for long studies is often limited during competitive electronics development timescales so providing options to simplify and speed the set up, run, stop and restart of multiple transient analysis cases is very advantageous.

see more: blogs.sw.siemens.com/simcenter/simcenter-flotherm-xt-2020-1-whats-new/

Download Siemens Simcenter FloTHERM XT 2304.0